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5-0701 (first published)
it does not have the precision of Test Method A because it uses less precise and less expensive fixturing and equipment
SEMI MF1727
SEMI 3D15-0316 (first published)
The tests include those listed below and are to be performed in the following order:
MF092800 - SEMI MF928 - Test Method for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates StdPbc-0317 5-0701 (first published)The edges of circular wafers of electronic materials are frequently required to be shaped after cutting the wafers from the ingot. Contouring the wafer edge reduces the incidence of chipping and minimizes epitaxial edge crown and photoresist edge bead during subsequent processing of the wafer. Similarly, edges of rigid disk substrates are frequently edge shaped. This Test Method described here provide means to determine that the wafer edge contour is